16 Layer HDI prototype

ENEPIG surface finishing

Home16 Layer HDI prototype

Project Description

16 Layer HDI prototype:

  • PCB Layer: 16Layer
  • Material: FR4 High TG
  • Board thickness: 5.08mm,
  • Finishing copper thickness: inner and outer 2/2oz,
  • Surface finished: ENEPIG.

Special technology:

  • Blind and Buried vias with 0.2mm in L1-L2,L2-L3,L14-L15,L15-L16, impedance control 50 ohm +/-10%.
  • Contersink holes
  • Impedance control

5.1mm board thickness

The board used a special surface finishing ENEPIG, it’s fantastic for ping board.

ENEPIG surface


This board used in semiconductor test board.

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