Fabrication Capability

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PCB Fabrication Capabilities :

Item Technical Parameters    Specification
Min Circuit Line Width/Space 2.7/3 mil Finished Copper Thickness H oz
Min PCB Pad Ring of Via  3 mil  Distance between hole edge to ring outskirt 
 Min PCB Pad Ring of PTH 5 mil  Distance between hole edge to ring outskirt  
 Min PCB Via Size 4 mil  Board Thickness < 1.2 mm 
 Min PCB Thickness of Double sided 0.2 mm  Final Board Thickness
Min PCB Thickness of Multilayer 0.4 mm Final Board Thickness
Max PCB Thickness  8.0 mm  Final Board Thickness 
 Max PCB Dimension 609×609 mm  Single and Double Sided  PCB
 Space Between Line to Board Edge 10 mil  Milling of Outline 
 Max PCB Layers 30 Layer   
PCB Solder Mask Openning 2 mil
PCB Solder Mask Bridge 6 mil Between IC Pins
PCB Solder Mask Color Green,Black,Blue,Red,white,Yellow,
PCB Silkscreen Symbol Width 5mil
PCB Silkscreen Color White,black,yellow
PCB Surface Finishing HASL,ENIG,ENEPIG,Immersion Silver, Immersion Tin,OSP,Gold Finger Plating
Copper Plating Hole 20um~25um
Max Finishing Copper Thickness 6 oz
Dielectric Thickness 2.5 mil
PCB Material FR-4,Aluminium substrate,Rogers4350C,Polyimide
Sepcial Technology HDI PCB, Via in Pad PCB,Blind&Buried PCB
PCB Type Rigid PCB, Flex PCB, Rigid-Flex PCB, Aluminum PCB

 

 

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