PCB Layer: 20 Layer
Material: FR4 High TG
Board thickness: 6.35mm,
Finishing copper thickness: inner and outer 1/1oz,
Surface finished: ENIG+hard gold plating 50u”.
Special technology:
1.Via in pad technology
2. Press-fit holes
3.impedance control 50 ohm +/-10%.
4.Contersink holes
This board used in semiconductor testing.
RO3003 PCB: Layers : 2 Layer PCB Material: Rogers RO3003 Board Thickness: 1.6mm Surface Finishing: ENIG(Gold thickness 2u”) Finished Copper thickness: 1/1OZ Special Process: Special
20 Layers ATE PCB board PCB Layer: 20 Layer Material: FR4 High TG Board thickness: 6.35mm, Finishing copper thickness: inner and outer 1/1oz, Surface finished:
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4 Layer PCB Assembly: Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole Advantages: One-stop service included PCB fabrication and PCBA. Components sourcing Cost-effective Min