Blind Via PCB

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Project Description

Blind Via PCB:

Layers:3 Layer 
PCB Material:FR4 High Tg 
Board Thickness:4.8mm
Surface Finishing:ENEPIG
Finished Copper thickness 2/2/0/2 OZ
Special Process:

HDI&Microvia(blindburied) PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil
The Minimum Via Size : 0.1mm
The Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Maximum Panel Dimension: 1200mm x 600mm
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm
Solder Mask Colour: Green White Black Red Blue Yellow
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
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