Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Advantages:
Service:
RO3003 PCB: Layers : 2 Layer PCB Material: Rogers RO3003 Board Thickness: 1.6mm Surface Finishing: ENIG(Gold thickness 2u”) Finished Copper thickness: 1/1OZ Special Process: Special
20 Layers ATE PCB board PCB Layer: 20 Layer Material: FR4 High TG Board thickness: 6.35mm, Finishing copper thickness: inner and outer 1/1oz, Surface finished:
Transparent solder mask PCB: Layers : 2 Layer PCB Material: FR4 TG170 Board Thickness: 0.16mm Surface Finishing: ENIG(Gold thickness 2u”) Finished Copper thickness: 1/1OZ Solder
4 Layer PCB Assembly: Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole Advantages: One-stop service included PCB fabrication and PCBA. Components sourcing Cost-effective Min