ROHS PCB Assembly

HomeHomeROHS PCB Assembly

Project Description

ROHS PCB Assembly:

Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole

Advantages:

  • One-stop service included PCB fabrication and PCBA.
  • Components sourcing
  • Cost-effective
  • Min order 1 pcs

Service:

  • PCB fabrication
  • Component sourcing

PCB Assembly Capability:

The Minimum PCB Dimension: 50x40mm
The Maximum PCB Dimension:600x400mm
The Maximum Component Height: 25mm
The Maximum PCB Weight: 3KG
The Minimum Components Size: 0201(0.5×0.25mm),Flip-CHIP,QFP,BGA,POP
The Maximum Components Size: 55mm
The Minimum PCB Dimension: 50x40mm
The Maximum PCB Dimension : 510x460mm
The BGA/QFP pitch :0.3mm
Testing: ICT, Burn-in, Function Test,Temperature Cycling
Quote Now

 

Related Portfolio