Via-In-Pad Plated Over PCB

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Project Description

Via-In-Pad Plated Over PCB:

Layers : 4 Layer PCB Material: FR4 Board Thickness: 0.8mm Surface Finishing: ENIG Finished Copper thickness:1/1/1/1 OZ Special Process: Via in Pad plated over Blind via: L1-L2 Standard PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil
The Minimum Via Size : 0.15mm
The Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB
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